Normal view MARC view ISBD view

Manufacturing challenges in electronic packaging / Y.C. Lee, W.T. Chen, [editors]. - 1st ed. - London ; New York : Chapman & Hall, 1998. - x, 261 p. : ill. ; 24 cm.

Includes bibliographical references and index.

ISBN: 0412620308 9780412620300

LCCN: 97075116

Subjects--Topical Terms:
Electronic packaging.
Manufacturing processes.

LC Class. No.: TK7870.15 / .M344 1998

Dewey Class. No.: 688.8