Printed circuits handbook / (Record no. 8746)

000 -LEADER
fixed length control field 04030cam a2200361 a 4500
001 - CONTROL NUMBER
control field u4191
003 - CONTROL NUMBER IDENTIFIER
control field SA-PMU
005 - DATE AND TIME OF LATEST TRANSACTION
control field 20210418124615.0
008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION
fixed length control field 070806s2008 nyua bf 001 0 eng
010 ## - LIBRARY OF CONGRESS CONTROL NUMBER
LC control number 2007032471
040 ## - CATALOGING SOURCE
Original cataloging agency DLC
Transcribing agency DLC
Modifying agency UKM
-- BAKER
-- BTCTA
-- YDXCP
-- AU@
-- C#P
-- UBA
-- CDN
-- HEBIS
-- DEBBG
020 ## - INTERNATIONAL STANDARD BOOK NUMBER
International Standard Book Number 0071467343 (alk. paper)
020 ## - INTERNATIONAL STANDARD BOOK NUMBER
International Standard Book Number 9780071467346 (alk. paper)
035 ## - SYSTEM CONTROL NUMBER
System control number (OCoLC)164570617
Canceled/invalid control number (OCoLC)76797921
050 00 - LIBRARY OF CONGRESS CALL NUMBER
Classification number TK7868.P7
Item number P76 2008
082 00 - DEWEY DECIMAL CLASSIFICATION NUMBER
Classification number 621.3815/31
Edition number 22
245 00 - TITLE STATEMENT
Title Printed circuits handbook /
Statement of responsibility, etc. Clyde F. Coombs, Jr., editor-in-chief.
250 ## - EDITION STATEMENT
Edition statement 6th ed.
260 ## - PUBLICATION, DISTRIBUTION, ETC.
Place of publication, distribution, etc. New York :
Name of publisher, distributor, etc. McGraw-Hill,
Date of publication, distribution, etc. c2008.
300 ## - PHYSICAL DESCRIPTION
Extent 1 v. (various pagings) :
Other physical details ill. ;
Dimensions 25 cm.
490 1# - SERIES STATEMENT
Series statement McGraw-Hill handbooks
504 ## - BIBLIOGRAPHY, ETC. NOTE
Bibliography, etc. note Includes bibliographical references and index.
505 0# - FORMATTED CONTENTS NOTE
Formatted contents note Section I: Introduction Chapter 1: Interconnectivity Chapter 2: Basic Semiconductor Components Chapter 3: Advanced Component Packaging Chapter 4: Types of Printed Circuits Section II: Materials Chapter 5: Introduction to Basic Materials Chapter 6: Base Material Components Chapter 7: Properties of Base Materials Chapter 8: Base Material Performance Issues Chapter 9: Impact of Lead-Free Assembly on Base Materials Chapter 10: Selecting Base Materials for Lead-Free Assembly Applications Chapter 11: Qualification and Evaluation of Materials Section III: Engineering and Design Chapter 12: Principles of PCB Design and Layout Chapter 13: Physical Characteristics Chapter 14: Electrical and Mechanical Properties Chapter 15: Thermal Issues Chapter 16: Designing PCB for Thermal Enhancement Chapter 17: Information Formatting and Transfer Chapter 18: Manufacturing Information Documentation and Transfer Chapter 19: Planning for Fabrication, Assembly and Test Chapter 20: Canodic Anodic Filaments Chapter 21: Embedded Passives Section IV: High Density Interconnection Chapter 22: Introduction to High Density Interconnection Technology Chapter 23: Advanced HDI Technology Section V: Fabrication Chapter 24: Drilling Chapter 25: Small Hole Fabrication Chapter 26: Imaging Chapter 27: Multilayer Chapter 28: Preparation for Plating Chapter 29: Electro-Plating Chapter 30: Direct Plating Chapter 31: Electroless Plating Chapter 32: Surface Finishing Chapter 33: Solder Resists and Masks Chapter 34: Etching Chapter 35: Machining and Routing Chapter 36: Process Control Section VI: Bare Board Test Chapter 37: Design for Bare Board Test Chapter 38: Test Methods Chapter 39: Test Equipment Chapter 40: HDI Testing Section VII: Assembly Chapter 41: Assembly Processes and Equipment Chapter 42: Conformal Coating Section VIII: Solders and Soldering Chapter 43: Solderability/Design for Soldering Chapter 44: Solders and Soldering Chapter 45: Fluxes and Cleaning Chapter 46: Press Fit Chapter 47: LCA Section IX: Quality Chapter 48: Fabricated Board Quality Chapter 49: Finished Assembly Quality Chapter 50: Assembled Board Inspection Chapter 51: Design for Assembled Board Test Chapter 52: Assembled Board Testing Section X: Reliability Chapter 53: Bare Board Reliability Chapter 54: Reliability of Component to Board Connection Chapter 55: Reliability Prediction Section XI: Environmental Issues Chapter 56: Waste Minimization Chapter 57: Waste Treatment Section XII: Flexible Circuits Chapter 58: Applications and Materials Chapter 59: Design Chapter 60: Manufacturing Chapter 61: Termination Chapter 62: Special Construction Chapter 63: Quality and Reliability APPENDIX A: IPC DOCUMENTS.
596 ## -
-- 1
650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element Printed circuits
Form subdivision Handbooks, manuals, etc.
700 1# - ADDED ENTRY--PERSONAL NAME
Personal name Coombs, Clyde F.
830 #0 - SERIES ADDED ENTRY--UNIFORM TITLE
Uniform title McGraw-Hill handbooks.
856 42 - ELECTRONIC LOCATION AND ACCESS
Materials specified Contributor biographical information
Uniform Resource Identifier <a href="http://catdir.loc.gov/catdir/enhancements/fy0814/2007032471-b.html">http://catdir.loc.gov/catdir/enhancements/fy0814/2007032471-b.html</a>
856 42 - ELECTRONIC LOCATION AND ACCESS
Materials specified Publisher description
Uniform Resource Identifier <a href="http://catdir.loc.gov/catdir/enhancements/fy0814/2007032471-d.html">http://catdir.loc.gov/catdir/enhancements/fy0814/2007032471-d.html</a>
856 41 - ELECTRONIC LOCATION AND ACCESS
Materials specified Table of contents only
Uniform Resource Identifier <a href="http://catdir.loc.gov/catdir/enhancements/fy0814/2007032471-t.html">http://catdir.loc.gov/catdir/enhancements/fy0814/2007032471-t.html</a>
942 ## - ADDED ENTRY ELEMENTS (KOHA)
Koha item type Books
994 ## -
-- Z0
-- SUPMU
Holdings
Withdrawn status Lost status Source of classification or shelving scheme Damaged status Not for loan Home library Current library Date acquired Total Checkouts Full call number Barcode Date last seen Copy number Price effective from Koha item type Public note
          Main Library Main Library 04/18/2021   TK7868 .P7 P76 2008 51952000068006 04/15/2021 1 04/15/2021 Books STACKS