| 000 -LEADER |
| fixed length control field |
04030cam a2200361 a 4500 |
| 001 - CONTROL NUMBER |
| control field |
u4191 |
| 003 - CONTROL NUMBER IDENTIFIER |
| control field |
SA-PMU |
| 005 - DATE AND TIME OF LATEST TRANSACTION |
| control field |
20210418124615.0 |
| 008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION |
| fixed length control field |
070806s2008 nyua bf 001 0 eng |
| 010 ## - LIBRARY OF CONGRESS CONTROL NUMBER |
| LC control number |
2007032471 |
| 040 ## - CATALOGING SOURCE |
| Original cataloging agency |
DLC |
| Transcribing agency |
DLC |
| Modifying agency |
UKM |
| -- |
BAKER |
| -- |
BTCTA |
| -- |
YDXCP |
| -- |
AU@ |
| -- |
C#P |
| -- |
UBA |
| -- |
CDN |
| -- |
HEBIS |
| -- |
DEBBG |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER |
| International Standard Book Number |
0071467343 (alk. paper) |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER |
| International Standard Book Number |
9780071467346 (alk. paper) |
| 035 ## - SYSTEM CONTROL NUMBER |
| System control number |
(OCoLC)164570617 |
| Canceled/invalid control number |
(OCoLC)76797921 |
| 050 00 - LIBRARY OF CONGRESS CALL NUMBER |
| Classification number |
TK7868.P7 |
| Item number |
P76 2008 |
| 082 00 - DEWEY DECIMAL CLASSIFICATION NUMBER |
| Classification number |
621.3815/31 |
| Edition number |
22 |
| 245 00 - TITLE STATEMENT |
| Title |
Printed circuits handbook / |
| Statement of responsibility, etc. |
Clyde F. Coombs, Jr., editor-in-chief. |
| 250 ## - EDITION STATEMENT |
| Edition statement |
6th ed. |
| 260 ## - PUBLICATION, DISTRIBUTION, ETC. |
| Place of publication, distribution, etc. |
New York : |
| Name of publisher, distributor, etc. |
McGraw-Hill, |
| Date of publication, distribution, etc. |
c2008. |
| 300 ## - PHYSICAL DESCRIPTION |
| Extent |
1 v. (various pagings) : |
| Other physical details |
ill. ; |
| Dimensions |
25 cm. |
| 490 1# - SERIES STATEMENT |
| Series statement |
McGraw-Hill handbooks |
| 504 ## - BIBLIOGRAPHY, ETC. NOTE |
| Bibliography, etc. note |
Includes bibliographical references and index. |
| 505 0# - FORMATTED CONTENTS NOTE |
| Formatted contents note |
Section I: Introduction Chapter 1: Interconnectivity Chapter 2: Basic Semiconductor Components Chapter 3: Advanced Component Packaging Chapter 4: Types of Printed Circuits Section II: Materials Chapter 5: Introduction to Basic Materials Chapter 6: Base Material Components Chapter 7: Properties of Base Materials Chapter 8: Base Material Performance Issues Chapter 9: Impact of Lead-Free Assembly on Base Materials Chapter 10: Selecting Base Materials for Lead-Free Assembly Applications Chapter 11: Qualification and Evaluation of Materials Section III: Engineering and Design Chapter 12: Principles of PCB Design and Layout Chapter 13: Physical Characteristics Chapter 14: Electrical and Mechanical Properties Chapter 15: Thermal Issues Chapter 16: Designing PCB for Thermal Enhancement Chapter 17: Information Formatting and Transfer Chapter 18: Manufacturing Information Documentation and Transfer Chapter 19: Planning for Fabrication, Assembly and Test Chapter 20: Canodic Anodic Filaments Chapter 21: Embedded Passives Section IV: High Density Interconnection Chapter 22: Introduction to High Density Interconnection Technology Chapter 23: Advanced HDI Technology Section V: Fabrication Chapter 24: Drilling Chapter 25: Small Hole Fabrication Chapter 26: Imaging Chapter 27: Multilayer Chapter 28: Preparation for Plating Chapter 29: Electro-Plating Chapter 30: Direct Plating Chapter 31: Electroless Plating Chapter 32: Surface Finishing Chapter 33: Solder Resists and Masks Chapter 34: Etching Chapter 35: Machining and Routing Chapter 36: Process Control Section VI: Bare Board Test Chapter 37: Design for Bare Board Test Chapter 38: Test Methods Chapter 39: Test Equipment Chapter 40: HDI Testing Section VII: Assembly Chapter 41: Assembly Processes and Equipment Chapter 42: Conformal Coating Section VIII: Solders and Soldering Chapter 43: Solderability/Design for Soldering Chapter 44: Solders and Soldering Chapter 45: Fluxes and Cleaning Chapter 46: Press Fit Chapter 47: LCA Section IX: Quality Chapter 48: Fabricated Board Quality Chapter 49: Finished Assembly Quality Chapter 50: Assembled Board Inspection Chapter 51: Design for Assembled Board Test Chapter 52: Assembled Board Testing Section X: Reliability Chapter 53: Bare Board Reliability Chapter 54: Reliability of Component to Board Connection Chapter 55: Reliability Prediction Section XI: Environmental Issues Chapter 56: Waste Minimization Chapter 57: Waste Treatment Section XII: Flexible Circuits Chapter 58: Applications and Materials Chapter 59: Design Chapter 60: Manufacturing Chapter 61: Termination Chapter 62: Special Construction Chapter 63: Quality and Reliability APPENDIX A: IPC DOCUMENTS. |
| 596 ## - |
| -- |
1 |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM |
| Topical term or geographic name entry element |
Printed circuits |
| Form subdivision |
Handbooks, manuals, etc. |
| 700 1# - ADDED ENTRY--PERSONAL NAME |
| Personal name |
Coombs, Clyde F. |
| 830 #0 - SERIES ADDED ENTRY--UNIFORM TITLE |
| Uniform title |
McGraw-Hill handbooks. |
| 856 42 - ELECTRONIC LOCATION AND ACCESS |
| Materials specified |
Contributor biographical information |
| Uniform Resource Identifier |
<a href="http://catdir.loc.gov/catdir/enhancements/fy0814/2007032471-b.html">http://catdir.loc.gov/catdir/enhancements/fy0814/2007032471-b.html</a> |
| 856 42 - ELECTRONIC LOCATION AND ACCESS |
| Materials specified |
Publisher description |
| Uniform Resource Identifier |
<a href="http://catdir.loc.gov/catdir/enhancements/fy0814/2007032471-d.html">http://catdir.loc.gov/catdir/enhancements/fy0814/2007032471-d.html</a> |
| 856 41 - ELECTRONIC LOCATION AND ACCESS |
| Materials specified |
Table of contents only |
| Uniform Resource Identifier |
<a href="http://catdir.loc.gov/catdir/enhancements/fy0814/2007032471-t.html">http://catdir.loc.gov/catdir/enhancements/fy0814/2007032471-t.html</a> |
| 942 ## - ADDED ENTRY ELEMENTS (KOHA) |
| Koha item type |
Books |
| 994 ## - |
| -- |
Z0 |
| -- |
SUPMU |