Semiconductor devices, physics and technology / S.M. Sze.

By: Sze, S. M, 1936-Material type: TextTextPublisher: New York : Wiley, c2002Edition: 2nd edDescription: viii, 564 p. : ill. (some col.) ; 26 cmISBN: 0471333727 (cloth : alk. paper); 9780471333722 (cloth : alk. paper)Subject(s): SemiconductorsDDC classification: 621.3815/2 LOC classification: TK7871.85 | .S9883 2002Online resources: Contributor biographical information | Publisher description | Table of contents
Contents:
Semiconductor Devices Semiconductor Technology Semiconductor Physics -- Energy Bands and Carrier Concentration in Thermal Equilibrium Semiconductor Materials Basic Crystal Structure Basic Crystal Growth Technique Valence Bonds Energy Bands Intrinsic Carrier Concentration Donors and Acceptors Carrier Transport Phenomena Carrier Drift Carrier Diffusion Generation and Recombination Processes Continuity Equation Thermionic Emission Process Tunneling Process High-Field Effects Semiconductor Devices -- p--n Junction Basic Fabrication Steps Thermal Equilibrium Condition Depletion Region Depletion Capacitance Current-Voltage Characteristics Charge Storage and Transient Behavior Junction Breakdown Heterojunction Bipolar Transistor and Related Devices Transistor Action Static Characteristics of Bipolar Transistor Frequency Response and Switching of Bipolar Transistor Heterojunction Bipolar Transistor Thyristor and Related Power Devices MOSFET and Related Devices MOS Diode MOSFET Fundamentals MOSFET Scaling CMOS and BiCMOS MOSFET on Insulator MOS Memory Structures Power MOSFET MESFET and Related Devices Metal-Semiconductor Contacts MESFET MODFET Microwave Diodes, Quantum-Effect, and Hot-Electron Devices Basic Microwave Technology Tunnel Diode IMPATT Diode Transferred-Electron Devices Quantum-Effect Devices Hot-Electron Devices Photonic Devices Radiative Transitions and Optical Absorption Light-Emitting Diodes Semiconductor Laser Photodetector Solar Cell Semiconductor Technology -- Crystal Growth and Epitaxy Silicon Crystal Growth from the Melt Silicon Float-Zone Process GaAs Crystal-Growth Techniques Material Characterization Epitaxial-Growth Techniques Structures and Defects in Epitaxial Layers Film Formation Thermal Oxidation Dielectric Deposition Polysilicon Deposition Metallization Lithography and Etching Optical Lithography Next-Generation Lithographic Methods Wet Chemical Etching Dry Etching Microelectromechanical Systems Impurity Doping Basic Diffusion Process Extrinsic Diffusion Diffusion-Related Processes Range of Implanted Ions Implant Damage and Annealing Implantation-Related Processes Integrated Devices Passive Components Bipolar Technology Mosfet Technology Mesfet Technology Challenges for Microelectronics International Systems of Units (SI Units) Unit Prefixes Greek Alphabet Physical Constants Properties of Important Element and Binary Compound Semiconductors at 300 K Properties of Si and GaAs at 300 K Derivation of the Density of States in ar Semiconductor Derivation of Recombination Rate for Indirect Recombination Calculation of the Transmission Coefficient for a Symmetric Resonant-Tunneling Diode Basic Kinetic Theory of Gases
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Includes bibliographical references and index.

1.1 Semiconductor Devices 1 -- 1.2 Semiconductor Technology 7 -- Part I Semiconductor Physics -- Chapter 2 Energy Bands and Carrier Concentration in Thermal Equilibrium 17 -- 2.1 Semiconductor Materials 17 -- 2.2 Basic Crystal Structure 19 -- 2.3 Basic Crystal Growth Technique 24 -- 2.4 Valence Bonds 27 -- 2.5 Energy Bands 28 -- 2.6 Intrinsic Carrier Concentration 34 -- 2.7 Donors and Acceptors 37 -- Chapter 3 Carrier Transport Phenomena 47 -- 3.1 Carrier Drift 48 -- 3.2 Carrier Diffusion 57 -- 3.3 Generation and Recombination Processes 60 -- 3.4 Continuity Equation 66 -- 3.5 Thermionic Emission Process 72 -- 3.6 Tunneling Process 73 -- 3.7 High-Field Effects 75 -- Part II Semiconductor Devices -- Chapter 4 p--n Junction 84 -- 4.1 Basic Fabrication Steps 85 -- 4.2 Thermal Equilibrium Condition 88 -- 4.3 Depletion Region 93 -- 4.4 Depletion Capacitance 100 -- 4.5 Current-Voltage Characteristics 104 -- 4.6 Charge Storage and Transient Behavior 114 -- 4.7 Junction Breakdown 117 -- 4.8 Heterojunction 124 -- Chapter 5 Bipolar Transistor and Related Devices 130 -- 5.1 Transistor Action 131 -- 5.2 Static Characteristics of Bipolar Transistor 137 -- 5.3 Frequency Response and Switching of Bipolar Transistor 146 -- 5.4 Heterojunction Bipolar Transistor 151 -- 5.5 Thyristor and Related Power Devices 156 -- Chapter 6 MOSFET and Related Devices 169 -- 6.1 MOS Diode 170 -- 6.2 MOSFET Fundamentals 186 -- 6.3 MOSFET Scaling 199 -- 6.4 CMOS and BiCMOS 205 -- 6.5 MOSFET on Insulator 209 -- 6.6 MOS Memory Structures 214 -- 6.7 Power MOSFET 218 -- Chapter 7 MESFET and Related Devices 224 -- 7.1 Metal-Semiconductor Contacts 225 -- 7.2 MESFET 237 -- 7.3 MODFET 247 -- Chapter 8 Microwave Diodes, Quantum-Effect, and Hot-Electron Devices 254 -- 8.1 Basic Microwave Technology 255 -- 8.2 Tunnel Diode 259 -- 8.3 IMPATT Diode 261 -- 8.4 Transferred-Electron Devices 264 -- 8.5 Quantum-Effect Devices 270 -- 8.6 Hot-Electron Devices 275 -- Chapter 9 Photonic Devices 282 -- 9.1 Radiative Transitions and Optical Absorption 282 -- 9.2 Light-Emitting Diodes 288 -- 9.3 Semiconductor Laser 298 -- 9.4 Photodetector 311 -- 9.5 Solar Cell 318 -- Part III Semiconductor Technology -- Chapter 10 Crystal Growth and Epitaxy 332 -- 10.1 Silicon Crystal Growth from the Melt 333 -- 10.2 Silicon Float-Zone Process 339 -- 10.3 GaAs Crystal-Growth Techniques 343 -- 10.4 Material Characterization 347 -- 10.5 Epitaxial-Growth Techniques 354 -- 10.6 Structures and Defects in Epitaxial Layers 361 -- Chapter 11 Film Formation 369 -- 11.1 Thermal Oxidation 370 -- 11.2 Dielectric Deposition 378 -- 11.3 Polysilicon Deposition 388 -- 11.4 Metallization 390 -- Chapter 12 Lithography and Etching 404 -- 12.1 Optical Lithography 404 -- 12.2 Next-Generation Lithographic Methods 418 -- 12.3 Wet Chemical Etching 426 -- 12.4 Dry Etching 431 -- 12.5 Microelectromechanical Systems 443 -- Chapter 13 Impurity Doping 452 -- 13.1 Basic Diffusion Process 453 -- 13.2 Extrinsic Diffusion 462 -- 13.3 Diffusion-Related Processes 466 -- 13.4 Range of Implanted Ions 469 -- 13.5 Implant Damage and Annealing 477 -- 13.6 Implantation-Related Processes 481 -- Chapter 14 Integrated Devices 489 -- 14.1 Passive Components 491 -- 14.2 Bipolar Technology 496 -- 14.3 Mosfet Technology 503 -- 14.4 Mesfet Technology 519 -- 14.5 Challenges for Microelectronics 522 -- Appendix B International Systems of Units (SI Units) 533 -- Appendix C Unit Prefixes 534 -- Appendix D Greek Alphabet 535 -- Appendix E Physical Constants 536 -- Appendix F Properties of Important Element and Binary Compound Semiconductors at 300 K 537 -- Appendix G Properties of Si and GaAs at 300 K 538 -- Appendix H Derivation of the Density of States in ar Semiconductor 539 -- Appendix I Derivation of Recombination Rate for Indirect Recombination 541 -- Appendix J Calculation of the Transmission Coefficient for a Symmetric Resonant-Tunneling Diode 543 -- Appendix K Basic Kinetic Theory of Gases 545.

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