TY  - BOOK
AU  - Lee,Yung-Cheng
AU  - Chen,William T.
TI  - Manufacturing challenges in electronic packaging
SN  - 0412620308
AV  - TK7870.15 .M344 1998
U1  - 688.8 20
PY  - 1998///
CY  - London, New York
PB  - Chapman & Hall
KW  - Electronic packaging
KW  - Manufacturing processes
N1  - Includes bibliographical references and index
UR  - http://catdir.loc.gov/catdir/enhancements/fy0821/97075116-d.html
UR  - http://catdir.loc.gov/catdir/enhancements/fy0821/97075116-t.html
ER  -