Printed circuits handbook / 
Clyde F. Coombs, Jr., editor-in-chief. 
 - 6th ed. 
 - New York :  McGraw-Hill,  c2008. 
 - 1 v. (various pagings) :  ill. ;  25 cm. 
 - McGraw-Hill handbooks .
 - McGraw-Hill handbooks. .
<br/><br/>Includes bibliographical references and index. 
<br/><br/>Section I: Introduction Chapter 1: Interconnectivity Chapter 2: Basic Semiconductor Components Chapter 3: Advanced Component Packaging Chapter 4: Types of Printed Circuits Section II: Materials Chapter 5: Introduction to Basic Materials Chapter 6: Base Material Components Chapter 7: Properties of Base Materials Chapter 8: Base Material Performance Issues Chapter 9: Impact of Lead-Free Assembly on Base Materials Chapter 10: Selecting Base Materials for Lead-Free Assembly Applications Chapter 11: Qualification and Evaluation of Materials Section III: Engineering and Design Chapter 12: Principles of PCB Design and Layout Chapter 13: Physical Characteristics Chapter 14: Electrical and Mechanical Properties Chapter 15: Thermal Issues Chapter 16: Designing PCB for Thermal Enhancement Chapter 17: Information Formatting and Transfer Chapter 18: Manufacturing Information Documentation and Transfer Chapter 19: Planning for Fabrication, Assembly and Test Chapter 20: Canodic Anodic Filaments Chapter 21: Embedded Passives Section IV: High Density Interconnection Chapter 22: Introduction to High Density Interconnection Technology Chapter 23: Advanced HDI Technology Section V: Fabrication Chapter 24: Drilling Chapter 25: Small Hole Fabrication Chapter 26: Imaging Chapter 27: Multilayer Chapter 28: Preparation for Plating Chapter 29: Electro-Plating Chapter 30: Direct Plating Chapter 31: Electroless Plating Chapter 32: Surface Finishing Chapter 33: Solder Resists and Masks Chapter 34: Etching Chapter 35: Machining and Routing Chapter 36: Process Control Section VI: Bare Board Test Chapter 37: Design for Bare Board Test Chapter 38: Test Methods Chapter 39: Test Equipment Chapter 40: HDI Testing Section VII: Assembly Chapter 41: Assembly Processes and Equipment Chapter 42: Conformal Coating Section VIII: Solders and Soldering Chapter 43: Solderability/Design for Soldering Chapter 44: Solders and Soldering Chapter 45: Fluxes and Cleaning Chapter 46: Press Fit Chapter 47: LCA Section IX: Quality Chapter 48: Fabricated Board Quality Chapter 49: Finished Assembly Quality Chapter 50: Assembled Board Inspection Chapter 51: Design for Assembled Board Test Chapter 52: Assembled Board Testing Section X: Reliability Chapter 53: Bare Board Reliability Chapter 54: Reliability of Component to Board Connection Chapter 55: Reliability Prediction Section XI: Environmental Issues Chapter 56: Waste Minimization Chapter 57: Waste Treatment Section XII: Flexible Circuits Chapter 58: Applications and Materials Chapter 59: Design Chapter 60: Manufacturing Chapter 61: Termination Chapter 62: Special Construction Chapter 63: Quality and Reliability APPENDIX A: IPC DOCUMENTS. 
<br/><br/><label>ISBN: </label>0071467343 (alk. paper) 9780071467346 (alk. paper) 
<br/><br/><label>LCCN: </label>2007032471 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Printed circuits--Handbooks, manuals, etc.
<br/><br/><label>LC Class. No.: </label>TK7868.P7  / P76 2008 
<br/><br/><label>Dewey Class. No.: </label>621.3815/31