TY  - BOOK
AU  - Coombs,Clyde F.
TI  - Printed circuits handbook
T2  - McGraw-Hill handbooks
SN  - 0071467343 (alk. paper)
AV  - TK7868.P7 P76 2008
U1  - 621.3815/31 22
PY  - 2008///
CY  - New York
PB  - McGraw-Hill
KW  - Printed circuits
KW  - Handbooks, manuals, etc
N1  - Includes bibliographical references and index; Section I: Introduction Chapter 1: Interconnectivity Chapter 2: Basic Semiconductor Components Chapter 3: Advanced Component Packaging Chapter 4: Types of Printed Circuits Section II: Materials Chapter 5: Introduction to Basic Materials Chapter 6: Base Material Components Chapter 7: Properties of Base Materials Chapter 8: Base Material Performance Issues Chapter 9: Impact of Lead-Free Assembly on Base Materials Chapter 10: Selecting Base Materials for Lead-Free Assembly Applications Chapter 11: Qualification and Evaluation of Materials Section III: Engineering and Design Chapter 12: Principles of PCB Design and Layout Chapter 13: Physical Characteristics Chapter 14: Electrical and Mechanical Properties Chapter 15: Thermal Issues Chapter 16: Designing PCB for Thermal Enhancement Chapter 17: Information Formatting and Transfer Chapter 18: Manufacturing Information Documentation and Transfer Chapter 19: Planning for Fabrication, Assembly and Test Chapter 20: Canodic Anodic Filaments Chapter 21: Embedded Passives Section IV: High Density Interconnection Chapter 22: Introduction to High Density Interconnection Technology Chapter 23: Advanced HDI Technology Section V: Fabrication Chapter 24: Drilling Chapter 25: Small Hole Fabrication Chapter 26: Imaging Chapter 27: Multilayer Chapter 28: Preparation for Plating Chapter 29: Electro-Plating Chapter 30: Direct Plating Chapter 31: Electroless Plating Chapter 32: Surface Finishing Chapter 33: Solder Resists and Masks Chapter 34: Etching Chapter 35: Machining and Routing Chapter 36: Process Control Section VI: Bare Board Test Chapter 37: Design for Bare Board Test Chapter 38: Test Methods Chapter 39: Test Equipment Chapter 40: HDI Testing Section VII: Assembly Chapter 41: Assembly Processes and Equipment Chapter 42: Conformal Coating Section VIII: Solders and Soldering Chapter 43: Solderability/Design for Soldering Chapter 44: Solders and Soldering Chapter 45: Fluxes and Cleaning Chapter 46: Press Fit Chapter 47: LCA Section IX: Quality Chapter 48: Fabricated Board Quality Chapter 49: Finished Assembly Quality Chapter 50: Assembled Board Inspection Chapter 51: Design for Assembled Board Test Chapter 52: Assembled Board Testing Section X: Reliability Chapter 53: Bare Board Reliability Chapter 54: Reliability of Component to Board Connection Chapter 55: Reliability Prediction Section XI: Environmental Issues Chapter 56: Waste Minimization Chapter 57: Waste Treatment Section XII: Flexible Circuits Chapter 58: Applications and Materials Chapter 59: Design Chapter 60: Manufacturing Chapter 61: Termination Chapter 62: Special Construction Chapter 63: Quality and Reliability APPENDIX A: IPC DOCUMENTS
UR  - http://catdir.loc.gov/catdir/enhancements/fy0814/2007032471-b.html
UR  - http://catdir.loc.gov/catdir/enhancements/fy0814/2007032471-d.html
UR  - http://catdir.loc.gov/catdir/enhancements/fy0814/2007032471-t.html
ER  -