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001			u11704
003			SA-PMU
005			20210418123331.0
008			140609s2015 flua b 001 0 eng
010			_a 2014021624
040			_aDLC _beng _erda _cDLC _dOCLCF _dYDXCP _dNDD _dUBY _dCRCPR _dCDX _dBTCTA _dVGM
019			_a873985511 _a874726389 _a897561116
020			_a9781466589407
020			_a146658940X
035			_a(OCoLC)881387794 _z(OCoLC)873985511 _z(OCoLC)874726389 _z(OCoLC)897561116
042			_apcc
050	0	0	_aTK7874.893 _b.D48 2015
082	0	0	_a621.3815 _223
245	0	0	_aDesign of 3D integrated circuits and systems / _cedited by, Rohit Sharma, Krzysztof Iniewski, foreword by Sung Kyu Lim.
264		1	_aBoca Raton : _bCRC Press/Taylor & Francis Group, _c[2015]
300			_axx, 304 pages : _billustrations ; _c24 cm.
336			_atext _btxt _2rdacontent
337			_aunmediated _bn _2rdamedia
338			_avolume _bnc _2rdacarrier
490	1		_aDevices, circuits, and systems
504			_aIncludes bibliographical references and index.
505	0		_a1. 3D integration technology with TSV and IMC bonding / Katsuyuki Sakuma -- 2. Wafer-level three-dimensional ICs for advanced CMOS integration / Ronald J. Gutmann and Jian-Qiang Lu -- 3. Integration of graphics processing cores with microprocessors / Deepak C. Sekar and Chinnakrishnan Ballapuram -- 4. Electrothermal simulation of three-dimensional integrated circuits / Shivam Priyadarshi, Jianchen Hu, Michael B. Steer, Paul D. Franzon, and W. Rhett Davis -- 5. Thermal management in 3D ICs/systems / Francesco Zanini -- 6. Emerging interconnect technologies for 3D networks-on-chip / Rohit Sharma and Kiyoung Choi -- 7. Inductive-coupling thruchip interface for 3D integration / Noriyuki Miura and Tadahiro Kuroda -- 8. Fabrication and modeling of copper and carbon nanotube-based through-silicon via / Brajesh Kumar Kaushik, Manoj Kumar Majumder, and Archana Kumari -- 9. Low-power testing for 2D/3D devices and systems / Xijiang Lin, Xiaoqing Wen, and Dong Xiang.
650		0	_aThree-dimensional integrated circuits.
650		7	_aThree-dimensional integrated circuits. _2fast _0(OCoLC)fst01765149
700	1		_aSharma, Rohit, _eeditor.
776	0	8	_iElectronic version: _z9781466589421
830		0	_aDevices, circuits, and systems.
938			_aYBP Library Services _bYANK _n11716942
938			_aCRC Press _bCRCP _nCRC00K20404000
938			_aCoutts Information Services _bCOUT _n27832154
938			_aBaker and Taylor _bBTCP _nBK0014664372
029	1		_aAU@ _b000054318832
029	1		_aNZ1 _b15913226
942			_cBOOK
994			_aZ0 _bSUPMU
948			_hNO HOLDINGS IN SUPMU - 53 OTHER HOLDINGS
596			_a1 2
999			_c2604 _d2604