| 000 | 01844cam a2200373 a 4500 | ||
|---|---|---|---|
| 001 | u8842 | ||
| 003 | SA-PMU | ||
| 005 | 20210418123454.0 | ||
| 008 | 030313s2003 nyua bf 001 0 eng | ||
| 010 | _a 2003046353 | ||
| 040 |
_aDLC _beng _cDLC _dEZU _dBAKER _dBTCTA _dYDXCP _dOCLCQ _dBDX _dOCLCF |
||
| 020 | _a0071402144 (alk. paper) | ||
| 020 | _a9780071402149 (alk. paper) | ||
| 035 | _a(OCoLC)51898631 | ||
| 050 | 0 | 0 |
_aTK7836 _b.E4654 2003 |
| 082 | 0 | 0 |
_a621.381 _221 |
| 245 | 0 | 0 |
_aElectronic materials and processes handbook / _cCharles A. Harper, editor in chief. |
| 250 | _a3rd ed. | ||
| 260 |
_aNew York : _bMcGraw-Hill, _c2003. |
||
| 300 |
_a1 v. (various pagings) : _bill. ; _c25 cm. |
||
| 490 | 1 | _aMcGraw-Hill handbooks | |
| 504 | _aIncludes bibliographical references and index. | ||
| 505 | 0 | _aDevelopment and fabrication of IC chips -- Plastics, elastomers, and composites -- Ceramics and glasses -- Metals -- Solder technologies for electronic packaging and assembly -- Electroplating and deposited metallic coatings -- Printed circuit board fabrication -- Materials and processes for hybrid microelectronics and multichip modules -- Adhesives, underfills, and coatings in electronics assemblies -- Thermal management materials and systems. | |
| 650 | 0 |
_aElectronics _xMaterials _vHandbooks, manuals, etc. |
|
| 650 | 0 |
_aElectronic apparatus and appliances _xMaterials _vHandbooks, manuals, etc. |
|
| 700 | 1 | _aHarper, Charles A. | |
| 830 | 0 | _aMcGraw-Hill handbooks. | |
| 856 | 4 | 2 |
_3Contributor biographical information _uhttp://catdir.loc.gov/catdir/bios/mh041/2003046353.html |
| 856 | 4 | 2 |
_3Publisher description _uhttp://catdir.loc.gov/catdir/description/mh031/2003046353.html |
| 856 | 4 | 1 |
_3Table of contents _uhttp://catdir.loc.gov/catdir/toc/mh031/2003046353.html |
| 942 | _cBOOK | ||
| 994 |
_aZ0 _bSUPMU |
||
| 596 | _a1 | ||
| 999 |
_c3270 _d3270 |
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