000 04030cam a2200361 a 4500
001 u4191
003 SA-PMU
005 20210418124615.0
008 070806s2008 nyua bf 001 0 eng
010 _a 2007032471
040 _aDLC
_cDLC
_dUKM
_dBAKER
_dBTCTA
_dYDXCP
_dAU@
_dC#P
_dUBA
_dCDN
_dHEBIS
_dDEBBG
020 _a0071467343 (alk. paper)
020 _a9780071467346 (alk. paper)
035 _a(OCoLC)164570617
_z(OCoLC)76797921
050 0 0 _aTK7868.P7
_bP76 2008
082 0 0 _a621.3815/31
_222
245 0 0 _aPrinted circuits handbook /
_cClyde F. Coombs, Jr., editor-in-chief.
250 _a6th ed.
260 _aNew York :
_bMcGraw-Hill,
_cc2008.
300 _a1 v. (various pagings) :
_bill. ;
_c25 cm.
490 1 _aMcGraw-Hill handbooks
504 _aIncludes bibliographical references and index.
505 0 _aSection I: Introduction Chapter 1: Interconnectivity Chapter 2: Basic Semiconductor Components Chapter 3: Advanced Component Packaging Chapter 4: Types of Printed Circuits Section II: Materials Chapter 5: Introduction to Basic Materials Chapter 6: Base Material Components Chapter 7: Properties of Base Materials Chapter 8: Base Material Performance Issues Chapter 9: Impact of Lead-Free Assembly on Base Materials Chapter 10: Selecting Base Materials for Lead-Free Assembly Applications Chapter 11: Qualification and Evaluation of Materials Section III: Engineering and Design Chapter 12: Principles of PCB Design and Layout Chapter 13: Physical Characteristics Chapter 14: Electrical and Mechanical Properties Chapter 15: Thermal Issues Chapter 16: Designing PCB for Thermal Enhancement Chapter 17: Information Formatting and Transfer Chapter 18: Manufacturing Information Documentation and Transfer Chapter 19: Planning for Fabrication, Assembly and Test Chapter 20: Canodic Anodic Filaments Chapter 21: Embedded Passives Section IV: High Density Interconnection Chapter 22: Introduction to High Density Interconnection Technology Chapter 23: Advanced HDI Technology Section V: Fabrication Chapter 24: Drilling Chapter 25: Small Hole Fabrication Chapter 26: Imaging Chapter 27: Multilayer Chapter 28: Preparation for Plating Chapter 29: Electro-Plating Chapter 30: Direct Plating Chapter 31: Electroless Plating Chapter 32: Surface Finishing Chapter 33: Solder Resists and Masks Chapter 34: Etching Chapter 35: Machining and Routing Chapter 36: Process Control Section VI: Bare Board Test Chapter 37: Design for Bare Board Test Chapter 38: Test Methods Chapter 39: Test Equipment Chapter 40: HDI Testing Section VII: Assembly Chapter 41: Assembly Processes and Equipment Chapter 42: Conformal Coating Section VIII: Solders and Soldering Chapter 43: Solderability/Design for Soldering Chapter 44: Solders and Soldering Chapter 45: Fluxes and Cleaning Chapter 46: Press Fit Chapter 47: LCA Section IX: Quality Chapter 48: Fabricated Board Quality Chapter 49: Finished Assembly Quality Chapter 50: Assembled Board Inspection Chapter 51: Design for Assembled Board Test Chapter 52: Assembled Board Testing Section X: Reliability Chapter 53: Bare Board Reliability Chapter 54: Reliability of Component to Board Connection Chapter 55: Reliability Prediction Section XI: Environmental Issues Chapter 56: Waste Minimization Chapter 57: Waste Treatment Section XII: Flexible Circuits Chapter 58: Applications and Materials Chapter 59: Design Chapter 60: Manufacturing Chapter 61: Termination Chapter 62: Special Construction Chapter 63: Quality and Reliability APPENDIX A: IPC DOCUMENTS.
650 0 _aPrinted circuits
_vHandbooks, manuals, etc.
700 1 _aCoombs, Clyde F.
830 0 _aMcGraw-Hill handbooks.
856 4 2 _3Contributor biographical information
_uhttp://catdir.loc.gov/catdir/enhancements/fy0814/2007032471-b.html
856 4 2 _3Publisher description
_uhttp://catdir.loc.gov/catdir/enhancements/fy0814/2007032471-d.html
856 4 1 _3Table of contents only
_uhttp://catdir.loc.gov/catdir/enhancements/fy0814/2007032471-t.html
942 _cBOOK
994 _aZ0
_bSUPMU
596 _a1
999 _c8746
_d8746