Design of 3D integrated circuits and systems /
edited by, Rohit Sharma, Krzysztof Iniewski, foreword by Sung Kyu Lim.
- xx, 304 pages : illustrations ; 24 cm.
- Devices, circuits, and systems .
- Devices, circuits, and systems. .
Includes bibliographical references and index.
1. 3D integration technology with TSV and IMC bonding / Katsuyuki Sakuma -- 2. Wafer-level three-dimensional ICs for advanced CMOS integration / Ronald J. Gutmann and Jian-Qiang Lu -- 3. Integration of graphics processing cores with microprocessors / Deepak C. Sekar and Chinnakrishnan Ballapuram -- 4. Electrothermal simulation of three-dimensional integrated circuits / Shivam Priyadarshi, Jianchen Hu, Michael B. Steer, Paul D. Franzon, and W. Rhett Davis -- 5. Thermal management in 3D ICs/systems / Francesco Zanini -- 6. Emerging interconnect technologies for 3D networks-on-chip / Rohit Sharma and Kiyoung Choi -- 7. Inductive-coupling thruchip interface for 3D integration / Noriyuki Miura and Tadahiro Kuroda -- 8. Fabrication and modeling of copper and carbon nanotube-based through-silicon via / Brajesh Kumar Kaushik, Manoj Kumar Majumder, and Archana Kumari -- 9. Low-power testing for 2D/3D devices and systems / Xijiang Lin, Xiaoqing Wen, and Dong Xiang.
9781466589407 146658940X
2014021624
Three-dimensional integrated circuits.
Three-dimensional integrated circuits.
TK7874.893 / .D48 2015
621.3815
Includes bibliographical references and index.
1. 3D integration technology with TSV and IMC bonding / Katsuyuki Sakuma -- 2. Wafer-level three-dimensional ICs for advanced CMOS integration / Ronald J. Gutmann and Jian-Qiang Lu -- 3. Integration of graphics processing cores with microprocessors / Deepak C. Sekar and Chinnakrishnan Ballapuram -- 4. Electrothermal simulation of three-dimensional integrated circuits / Shivam Priyadarshi, Jianchen Hu, Michael B. Steer, Paul D. Franzon, and W. Rhett Davis -- 5. Thermal management in 3D ICs/systems / Francesco Zanini -- 6. Emerging interconnect technologies for 3D networks-on-chip / Rohit Sharma and Kiyoung Choi -- 7. Inductive-coupling thruchip interface for 3D integration / Noriyuki Miura and Tadahiro Kuroda -- 8. Fabrication and modeling of copper and carbon nanotube-based through-silicon via / Brajesh Kumar Kaushik, Manoj Kumar Majumder, and Archana Kumari -- 9. Low-power testing for 2D/3D devices and systems / Xijiang Lin, Xiaoqing Wen, and Dong Xiang.
9781466589407 146658940X
2014021624
Three-dimensional integrated circuits.
Three-dimensional integrated circuits.
TK7874.893 / .D48 2015
621.3815