| 000 -LEADER |
|---|
| fixed length control field |
02718cam a2200481 i 4500 |
| 001 - CONTROL NUMBER |
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| control field |
u11704 |
| 003 - CONTROL NUMBER IDENTIFIER |
|---|
| control field |
SA-PMU |
| 005 - DATE AND TIME OF LATEST TRANSACTION |
|---|
| control field |
20210418123331.0 |
| 008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION |
|---|
| fixed length control field |
140609s2015 flua b 001 0 eng |
| 010 ## - LIBRARY OF CONGRESS CONTROL NUMBER |
|---|
| LC control number |
2014021624 |
| 040 ## - CATALOGING SOURCE |
|---|
| Original cataloging agency |
DLC |
| Language of cataloging |
eng |
| Description conventions |
rda |
| Transcribing agency |
DLC |
| Modifying agency |
OCLCF |
| -- |
YDXCP |
| -- |
NDD |
| -- |
UBY |
| -- |
CRCPR |
| -- |
CDX |
| -- |
BTCTA |
| -- |
VGM |
| 019 ## - |
|---|
| -- |
873985511 |
| -- |
874726389 |
| -- |
897561116 |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER |
|---|
| International Standard Book Number |
9781466589407 |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER |
|---|
| International Standard Book Number |
146658940X |
| 035 ## - SYSTEM CONTROL NUMBER |
|---|
| System control number |
(OCoLC)881387794 |
| Canceled/invalid control number |
(OCoLC)873985511 |
| -- |
(OCoLC)874726389 |
| -- |
(OCoLC)897561116 |
| 042 ## - AUTHENTICATION CODE |
|---|
| Authentication code |
pcc |
| 050 00 - LIBRARY OF CONGRESS CALL NUMBER |
|---|
| Classification number |
TK7874.893 |
| Item number |
.D48 2015 |
| 082 00 - DEWEY DECIMAL CLASSIFICATION NUMBER |
|---|
| Classification number |
621.3815 |
| Edition number |
23 |
| 029 1# - OTHER SYSTEM CONTROL NUMBER (OCLC) |
|---|
| OCLC library identifier |
AU@ |
| System control number |
000054318832 |
| 029 1# - OTHER SYSTEM CONTROL NUMBER (OCLC) |
|---|
| OCLC library identifier |
NZ1 |
| System control number |
15913226 |
| 245 00 - TITLE STATEMENT |
|---|
| Title |
Design of 3D integrated circuits and systems / |
| Statement of responsibility, etc. |
edited by, Rohit Sharma, Krzysztof Iniewski, foreword by Sung Kyu Lim. |
| 264 #1 - PRODUCTION, PUBLICATION, DISTRIBUTION, MANUFACTURE, AND COPYRIGHT NOTICE |
|---|
| Place of production, publication, distribution, manufacture |
Boca Raton : |
| Name of producer, publisher, distributor, manufacturer |
CRC Press/Taylor & Francis Group, |
| Date of production, publication, distribution, manufacture, or copyright notice |
[2015] |
| 300 ## - PHYSICAL DESCRIPTION |
|---|
| Extent |
xx, 304 pages : |
| Other physical details |
illustrations ; |
| Dimensions |
24 cm. |
| 336 ## - CONTENT TYPE |
|---|
| Content type term |
text |
| Content type code |
txt |
| Source |
rdacontent |
| 337 ## - MEDIA TYPE |
|---|
| Media type term |
unmediated |
| Media type code |
n |
| Source |
rdamedia |
| 338 ## - CARRIER TYPE |
|---|
| Carrier type term |
volume |
| Carrier type code |
nc |
| Source |
rdacarrier |
| 490 1# - SERIES STATEMENT |
|---|
| Series statement |
Devices, circuits, and systems |
| 504 ## - BIBLIOGRAPHY, ETC. NOTE |
|---|
| Bibliography, etc. note |
Includes bibliographical references and index. |
| 505 0# - FORMATTED CONTENTS NOTE |
|---|
| Formatted contents note |
1. 3D integration technology with TSV and IMC bonding / Katsuyuki Sakuma -- 2. Wafer-level three-dimensional ICs for advanced CMOS integration / Ronald J. Gutmann and Jian-Qiang Lu -- 3. Integration of graphics processing cores with microprocessors / Deepak C. Sekar and Chinnakrishnan Ballapuram -- 4. Electrothermal simulation of three-dimensional integrated circuits / Shivam Priyadarshi, Jianchen Hu, Michael B. Steer, Paul D. Franzon, and W. Rhett Davis -- 5. Thermal management in 3D ICs/systems / Francesco Zanini -- 6. Emerging interconnect technologies for 3D networks-on-chip / Rohit Sharma and Kiyoung Choi -- 7. Inductive-coupling thruchip interface for 3D integration / Noriyuki Miura and Tadahiro Kuroda -- 8. Fabrication and modeling of copper and carbon nanotube-based through-silicon via / Brajesh Kumar Kaushik, Manoj Kumar Majumder, and Archana Kumari -- 9. Low-power testing for 2D/3D devices and systems / Xijiang Lin, Xiaoqing Wen, and Dong Xiang. |
| 596 ## - |
|---|
| -- |
1 2 |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM |
|---|
| Topical term or geographic name entry element |
Three-dimensional integrated circuits. |
| 650 #7 - SUBJECT ADDED ENTRY--TOPICAL TERM |
|---|
| Topical term or geographic name entry element |
Three-dimensional integrated circuits. |
| Source of heading or term |
fast |
| Authority record control number or standard number |
(OCoLC)fst01765149 |
| 700 1# - ADDED ENTRY--PERSONAL NAME |
|---|
| Personal name |
Sharma, Rohit, |
| Relator term |
editor. |
| 776 08 - ADDITIONAL PHYSICAL FORM ENTRY |
|---|
| Relationship information |
Electronic version: |
| International Standard Book Number |
9781466589421 |
| 830 #0 - SERIES ADDED ENTRY--UNIFORM TITLE |
|---|
| Uniform title |
Devices, circuits, and systems. |
| 938 ## - |
|---|
| -- |
YBP Library Services |
| -- |
YANK |
| -- |
11716942 |
| 938 ## - |
|---|
| -- |
CRC Press |
| -- |
CRCP |
| -- |
CRC00K20404000 |
| 938 ## - |
|---|
| -- |
Coutts Information Services |
| -- |
COUT |
| -- |
27832154 |
| 938 ## - |
|---|
| -- |
Baker and Taylor |
| -- |
BTCP |
| -- |
BK0014664372 |
| 942 ## - ADDED ENTRY ELEMENTS (KOHA) |
|---|
| Koha item type |
Books |
| 994 ## - |
|---|
| -- |
Z0 |
| -- |
SUPMU |
| 948 ## - LOCAL PROCESSING INFORMATION (OCLC); SERIES PART DESIGNATOR (RLIN) |
|---|
| h (OCLC) |
NO HOLDINGS IN SUPMU - 53 OTHER HOLDINGS |