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    III-V integrated circuit fabrication technology / Shiban Tiku, Dhrubes Biswas.

    By: Tiku, Shiban Kishan [author.]Contributor(s): Biswas, Dhrubes [author.]Material type: TextTextPublisher: Singapore : Pan Stanford Publishing, [2016]Copyright date: ©2016Description: xxv, 687 pages : illustrations (some color) ; 24 cmContent type: text Media type: unmediated Carrier type: volumeISBN: 9789814669306; 981466930XOther title: Three-five integrated circuit fabrication technology | 3-5 integrated circuit fabrication technologySubject(s): Compound semiconductors | Integrated circuits | Compound semiconductors | Integrated circuitsLOC classification: QC611.8.C64 | T55 2016
    Contents:
    1. Semiconductor basics -- 2. GaAs devices -- 3. Phase diagrams and crystal growth of compound semiconductors -- 4. Epitaxy -- 5. Photolithography -- 6. Wet etching, cleaning, and passivation -- 7. Plasma processing and dry etching -- 8. Deposition processes -- 9. Ion implantation and device isolation -- 10. Diffusion in III-V compound semiconductors -- 11. Ohmic contacts -- 12. Schottky diodes and FET processing -- 13. HEMT process -- 14. HBT processing -- 15. BiFET and BiHEMT processing -- 16. MOSFET processing -- 17. Passive components -- 18. Interconnect technology -- 19. Backend processing and through-wafer vias -- 20. Electroplating -- 21. Measurements and characterization -- 22. Reliability -- 23. GaN devices -- 24. RF MEMS.
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    Item type Current library Call number Copy number Status Notes Date due Barcode
    Books Books Female Library
    		QC611.8.C64 .T55 2016 (Browse shelf (Opens below)) 1 Available STACKS 51952000238409
    Books Books Main Library
    		QC611.8.C64 .T55 2016 (Browse shelf (Opens below)) 1 Available STACKS 51952000238393

    Includes bibliographical references and index.

    1. Semiconductor basics -- 2. GaAs devices -- 3. Phase diagrams and crystal growth of compound semiconductors -- 4. Epitaxy -- 5. Photolithography -- 6. Wet etching, cleaning, and passivation -- 7. Plasma processing and dry etching -- 8. Deposition processes -- 9. Ion implantation and device isolation -- 10. Diffusion in III-V compound semiconductors -- 11. Ohmic contacts -- 12. Schottky diodes and FET processing -- 13. HEMT process -- 14. HBT processing -- 15. BiFET and BiHEMT processing -- 16. MOSFET processing -- 17. Passive components -- 18. Interconnect technology -- 19. Backend processing and through-wafer vias -- 20. Electroplating -- 21. Measurements and characterization -- 22. Reliability -- 23. GaN devices -- 24. RF MEMS.

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