Manufacturing challenges in electronic packaging / Y.C. Lee, W.T. Chen, [editors].

Contributor(s): Lee, Yung-Cheng | Chen, William TMaterial type: TextTextPublisher: London ; New York : Chapman & Hall, 1998Edition: 1st edDescription: x, 261 p. : ill. ; 24 cmISBN: 0412620308; 9780412620300Subject(s): Electronic packaging | Manufacturing processesDDC classification: 688.8 LOC classification: TK7870.15 | .M344 1998Online resources: Publisher description | Table of contents only
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TK7870.15 .M344 1998 (Browse shelf (Opens below)) 1 Available STACKS 51952000062172

Includes bibliographical references and index.

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