Design of 3D integrated circuits and systems / edited by, Rohit Sharma, Krzysztof Iniewski, foreword by Sung Kyu Lim.
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TextSeries: Devices, circuits, and systems: Publisher: Boca Raton : CRC Press/Taylor & Francis Group, [2015]Description: xx, 304 pages : illustrations ; 24 cmContent type: text Media type: unmediated Carrier type: volumeISBN: 9781466589407; 146658940XSubject(s): Three-dimensional integrated circuits | Three-dimensional integrated circuitsAdditional physical formats: Electronic version:: No titleDDC classification: 621.3815 LOC classification: TK7874.893 | .D48 2015| Item type | Current library | Call number | Copy number | Status | Notes | Date due | Barcode |
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Female Library | TK7874.893 .D48 2015 (Browse shelf (Opens below)) | 1 | Available | STACKS | 51952000316022 | |
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| TK7874.75 .X55 2008 VLSI circuit design methodology demystified : a conceptual taxonomy / | TK7874.84 .D873 2015 Nanoelectromechanical systems / | TK7874.887 .L58 2016 Wide bandgap semiconductor spintronics / | TK7874.893 .D48 2015 Design of 3D integrated circuits and systems / | TK7875 .M53 2008 Micro and nano mechanical testing of materials and devices / | TK7876 .D36 2008 Microwave engineering / | TK7876 .W4897 2004 High frequency techniques : an introduction to RF and microwave engineering / |
Includes bibliographical references and index.
1. 3D integration technology with TSV and IMC bonding / Katsuyuki Sakuma -- 2. Wafer-level three-dimensional ICs for advanced CMOS integration / Ronald J. Gutmann and Jian-Qiang Lu -- 3. Integration of graphics processing cores with microprocessors / Deepak C. Sekar and Chinnakrishnan Ballapuram -- 4. Electrothermal simulation of three-dimensional integrated circuits / Shivam Priyadarshi, Jianchen Hu, Michael B. Steer, Paul D. Franzon, and W. Rhett Davis -- 5. Thermal management in 3D ICs/systems / Francesco Zanini -- 6. Emerging interconnect technologies for 3D networks-on-chip / Rohit Sharma and Kiyoung Choi -- 7. Inductive-coupling thruchip interface for 3D integration / Noriyuki Miura and Tadahiro Kuroda -- 8. Fabrication and modeling of copper and carbon nanotube-based through-silicon via / Brajesh Kumar Kaushik, Manoj Kumar Majumder, and Archana Kumari -- 9. Low-power testing for 2D/3D devices and systems / Xijiang Lin, Xiaoqing Wen, and Dong Xiang.
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